Optical Surface Profile Measurement Instrument for Bores and Cylindrical Workpieces

Surface inspection of cylinder bores Defect recognition in bores and on the outside face Fast, non-contact and precise measurement of micro structure, roughness, machining marks, defects, pores, scratches, and various surface features in (small) bores and on the outside face of cylindrical workpieces Measurement and evaluation of object specific surface features including coatings and wear Quality control of coatings High resolution, large areas via stitching Relatively Maintenance-free For production and in-line applications

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The judgement and documentation of cylinder faces, i.e . of large engines, required so far a lot of time and money.

This new instrument solves this task both fast and ergonomically. To this end a linear photo diode array with integral illumination is inserted into the cylinder bore.  It supports itself using a three-legged fixture on the upper side of the cylinder liner. With the help of a motor the diode array is rotated by 360° and thereby continuously takes high resolution photographs of parts or of the entire cylinder face. In order to avoid a negative influence of a possible decentering and wobble errors the diode array supports itself via plastics rollers  at the cylinder face.

The system is modularly designed and enables checking workpieces upto a diameter of 800 mm and a depth of 1200 mm. The photo diode array can either be clocked manually or set to the desired depth via a shifting mechanism.

Effects like polished sheet metals, no clean up areas, scratches, pits, carbonisation, scuffing and corrosion are features to be detected. The honing structure and defects are separated by the software.

 

Design features

 

Scan area	[°]	360
Bore Ø min.	[mm]	150
Bore Ø max.	[mm]	800
Bore depth min.	[mm]	160
Bore depth max	[mm]	1200

 

This scanner is modularly built and can be mounted in many ways on the workpiece using exchangeable fixtures. The holders with different lengths can be exchanged.

 

1 Scanning with combined, heightwise adjustable linear photo diode arrays in one inspection run..

2 Scanning with a short array and several inspection runs. In this case the array is manually readjusted in
the vertical position after a scan.

3 Optionally the height adjustment can be done by a software controlled motor. In this case the array is
lifted up from the workpiece during the displacement.