www.breitmeier.de

General

 

 

  • Non-contact high precision thickness measurements of MEMS, silicon beams, transparent thin materials
  • Resolution in the nanometer range
  • Ease of use and designed for manual or automated measurement procedures
  • Insensitive with regard to temperature changes or heating up effects
  • Excellent repeatability
  • Option: additional surface profile measurement

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 
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